The POU3500 program delivers dynamic temperature control of the method chamber cathode / electrode / anode and can be synchronized with any etch system.
Resource & TCU application calibration procedures differ exterior examination tools not utilised frequently for verifying
Along with the POU3500, you'll be able to attain unprecedented leads to etch general performance, chamber uptime, lessened expense of possession and fab Place utilization – all even though improving your approach dependability.
initially Established in 1985, our business has developed into a identified leader in furnishing temperature Manage methods to the global semiconductor field.
LAUDA-Noah will, for any purchaser's retrofit analysis, observe and alter its fluid temperature Command profiles to match an existing TCUs' if you want to guarantee a easy process integration via DAQ.
The accuracy in the POU 3300 allows for unbiased Charge of the procedure fluid temperature into the wafer chuck within +/- 0.1 °C of set issue, and the rapid reaction time of your program permits for optimum wafer-to-wafer repeatability throughout the etch system.
All static TCUs demand excessive cooling & heating capacities due to their incredibly huge course of action fluid reservoirs. the procedure fuid reservoir on LAUDA-Noah's dynamic temperature Regulate method is lower than one gallon.
With all the POU3300, you could accomplish unprecedented leads to etch performance, chamber uptime, decreased price of possession and fab Area utilization – all when enhancing your approach trustworthiness.
the info pertains to the 300mm chamber temperature profile all through a significant component ratio Etch process, functioning at pretty substantial RF energy disorders (~3.8kW). The persuasive areas of this data established are:
LAUDA-Noah is Assembly these new worries and it has included energy preserving technological know-how in devices which have been friendly to your ecosystem and also have a affordable to operate.
The TEs' can change directly from heating to cooling, or visa-versa. they might activate & off though within the heating or cooling mode and will enhance or lower the level of heating or cooling without the need of switching by any means.
in excess of at any time, shrinking system geometries, demanding new procedures and a extremely competitive surroundings involve temperature Regulate methods that Blend rapid and correct temperature Manage with the emphasis on diminished working expenditures and improved reliability.
verified; TEs' stand for just one A part of a chiller's design. The switching & Manage procedures utilized by a chiller will impression the TEs' trustworthiness.
(for that reason, installing a static device close to chamber is not going to allow it to supply dynamic temperature Command)
We need get more info significantly less cooling/heating capability for a similar software being a static TCU as a result of our little reservoir quantity.